PhD/Postdoc Positions in Semiconductor Packaging and Thermal Transport at Purdue University

- PhD/Postdoc Positions, Purdue University, USA

- Semiconductor advanced packaging, 3D system heterogeneous integration, and thermal transport

- Dr. Tiwei Wei:

- Our laboratory has several opening positions in the fields of semiconductor advanced packaging, 3D system heterogeneous integration, and thermal transport.

- Openings Breakdown:
  1. PhD and Postdoc Positions: Project: "Advancing Semiconductor Device Packaging through materials, processing, and Architecture Development"
     - Requirements: Strong foundation in semiconductor device fabrication techniques (lithography, DRIE, PVD, CVD, ALD, Cu ECD, CMP)
     - Experience in wafer thinning and temporary bonding
     - Proficiency in advanced electronic packaging technologies (TSV, Cu/SiO2 hybrid bonding, TGV, RDL, microbump)
     - Expertise in micro/nano fabrications and hands-on cleanroom experience.

  2. PhD and Postdoc Roles: Project: "thermal and Thermomechanical reliability in Electronic Devices including FEOL, BEOL Metal Interconnects, and Advanced Packaging"
     - Requirements: Background in semiconductor fabrication processes and advanced electronic packaging fabrication technologies
     - Proficiency in thermal simulations (Monte Carlo BTE, FEM, Molecular dynamics)
     - Deep understanding of microscale and nanoscale heat transfer, heat and mass transfer theory.

  3. PhD Opportunities: Project: "Innovative Microscale microfluidics Cooling Techniques for Electronic Packaging"
     - Requirements: Expertise in numerical modeling (CFD, FEM)
     - Hands-on experience in experimental characterization of cooling methods
     - Practical experience with micro/nano fabrications in cleanroom environments.

  4. Lillian Gilbreth Postdoctoral Fellowships at Purdue Engineering: Project: "Utilizing AI and Physics for the Design and Fabrication of Targeted Microjet Cooling in High-Performance Computation Systems"
     - Supervision: Collaborate with Prof. Guang Lin
     - Fellowship involves leveraging AI-driven design principles and physics insights for microjet cooling in computation systems.

- To find out more and apply, visit our official website:

https://alphalab-purdue.org/
- Interested? Email us at tiwei@purdue.edu
- Help us spread the word to your friends and contacts. We'd be grateful!

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